ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
ABLEBOND®84-1LMIT乐泰胶水,导电环氧树脂粘合剂
技术服务热线：021-51693135 / 021-22818476
ABLEBOND®84-1LMIT高导热芯片贴附粘合剂Ablebond®84-1LMIT导电环氧树脂粘合剂的导热系数比其他填充银的环氧树脂高出三倍。这种高纯度，低脱气粘合剂满足方法5011的固化2的供应商要求 小时在150°C。 对于方法5011进行测试时，请参见反面。结合84-1LMIT粘合剂无溶剂，使其适合通过注射器分配或丝网印刷（200目）进行应用。 注意：150℃下需要2小时固化以满足所列的150℃下的模切需求。储存寿命Ablebond 84-1LMIT粘合剂可在-40°C下储存1年。
ABLEBOND® 84-1LMIT HIGH THERMAL CONDUCTIVITY CHIP ATTACH ADHESIVE Ablebond® 84-1LMIT electrically conductive epoxy adhesive exhibits a thermal conductivity three times higher than other silver filled epoxies.This high purity, low outgassing adhesive meets the supplier requirements of Method 5011 when cured 2 hours at 150°C. See reverse side for results when tested to Method 5011.Ablebond 84-1LMIT adhesive is solvent-free, making it suitable for application by syringe dispensing or screen printing (200-mesh). NOTE: A 2-hour cure at 150°C is necessary to meet the die shear requirement at 150°C as listed.STORAGE LIFE Ablebond 84-1LMIT adhesive may be stored up to 1 year at –40°C |
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