铝基板，LED铝基板，美国贝格斯铝基板，高导热铝基板，铝基板PCB，铝基板线路板，MCPCB, 贝格斯导热材料，Bergquist铝基板
Thermal Clad性能参数表：
单层板
SINGLE LAYER 导热性能
THERMAL PERFORMANCE 电绝缘性能
DIELECTRIC PERFORMANCE 其他
OHTER
产品型号
Part Number 绝缘层厚度1
Thickness［mil/μm］ 热阻2
Impedance［℃/W］ 热阻3
Impedance［℃in2/W］[/℃cm2/W] 导热系数4
Conductivity［W/m-K］ 击穿电压5
Breakdown［KVAC］ 介电常数6
Permitivity
(Dielectric
Constant) 玻璃转化温度7
Glass Transition［℃］ UL温度指数8
UL Index［℃］ 剥离强度9
Peel Strength［lb/in］/[N/mm]
HT-04503 3/76 0.45 0.05/0.32 2.2 6.0 7 150 140/140 6/1.1
HT-07006 6/152 0.70 0.11/0.71 2.2 11.0 7 150 140/140 6/1.1
MP-06503 3/76 0.65 0.09/0.58 1.3 8.5 6 90 130/140 9/1.6
HPL-03015 1.5/38 0.30 0.02/0.13 3.0 2.5 6 185 ** 5/0.9
HR T30.20 3/76 0.90 0.15/0.97 0.8 7.5 7 90 130/130 9/1.6
测试方法Method Description：
1 – Optical 6 - ASTM D150
2 - Bergquist TO-220 test RD2018 7 – Internal MDSC test RD2014
3 – Calculation from ASTM 5470 8 –UL 746 E
4 – Extended ASTM 5470 9 - ASTM D2861 ** Pending
5 - ASTM D149
Note: For applications with an expected voltage over 480 Volts AC,Bergquist recommends a dielectric thickness greater than 0.003”(76um).
Note: Maximum test voltage is a function of material and circuit design.Typical proof test does not represent the maximum.
Note: Circuit design is the most important consideration for determining safety agency compl |
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