规格：
高纯银：99.999% Ag-5N-F-29
检测杂质：Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn
杂质总含量：≤10ppm
高纯银：99.9999% Ag-6N-F-30
检测杂质：Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn
杂质总含量：≤1ppm
用途：主要用于制备高纯半导体合金、电子管、晶体管焊接材料、精密仪表接点材料及原子反应堆控制棒等。
包装：聚乙烯塑料瓶包装外套双层复合膜真空封装或玻璃管真空封装。
Specification:
High purity Ag: 99.999% Ag-5N-F-29
Testing impurity: Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn
Total impurity content: ≤10ppm
High purity Ag: 99.9999% Ag-6N-F-30
Testing impurity: Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn
Total impurity content: ≤1ppm
Application: Used for the preparation of high purity semiconductor alloy, electron tubes, transistor welding material, precision meter contact material, and control rod of atomic reactor etc.
Package: Packed with polythene plastic bottle, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.
注：产品实际价格以询价为准！ |
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